Heat sinks for integrated circuit modules
US4508163A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 18, 1983 |
| Grant date | Apr 2, 1985 |
| Priority date | — |
| Expiry date | Jan 18, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In dissipating heat from miniature electronic devices, circuit modules, or the like, and particularly from dual-in-line package (DIP) type units having leads depending from opposite sides of a thin molded rectangular-parallelpiped body, an elongated sheet-metal strip of heat-radiating elements disposed above and in spaced relation to the top of the package has its opposite ends integrally connected with separate spaced heat-conducting clip members are cantilevered from it in different directions to fit respectively about the top and bottom surfaces of the package and to flex so as to accomodate insertion of the package between them and yet adjust themselves into abutments with those surfaces. Heat conducted away from the package by each of the cantilevered members first reaches a different end of the strip of heat-radiating elements, without interfering with the heat-exchange taking place along the opposite surfaces of the package clipped between the members. The two clip members are of configurations exhibiting different stiffness, and are cantilevered from the heat-radiating strip by way of different-length connections, such that these members, once spread widely apart, tend not …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.