Process for producing aromatic imide polymer laminate material
US4508766A · kind A · utility
18Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1983 |
| Grant date | Apr 2, 1985 |
| Priority date | — |
| Expiry date | Apr 21, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An aromatic imide polymer laminate material usable as a flexible circuit board substrate is produced by the process comprising coating a surface of a metallic foil with a solution of an aromatic imide polymer comprising at least 90 molar % of recurring unit of the formula (I): ##STR1## wherein R is a symmetrical bivalent aromatic radical having no substituent, and dissolved in a solvent consisting essentially of at least one phenolic compound; and heat drying the resultant solution layer to form an aromatic imide polymer solid layer firmly bonded directly to the metallic foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.