Patent · US Expired

Process and apparatus for bonding particulate material, in particular chips

US4510184A · kind A · utility

13Cited by

4References

7Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Hermann Winkler · Recklinghausen, DE
Hanns I. Sachs · Cologne, DE

Key dates

Filing date	Oct 22, 1982
Grant date	Apr 9, 1985
Priority date	—
Expiry date	Oct 22, 2002

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB27N1/02
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

For achieving optimum application of bonding agent to particulate material, in particular chips, without elaborate plant and machinery, it is proposed to carry out the application of bonding agent using a pneumatic conveyor device for material which is in any case present, by arranging at least one spray nozzle for bonding agent in at least one section of the pipes of the material transport device and spraying the particles which are transported in the form of a film, using this spray nozzle for bonding agent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.