Automated polisher for cylindrical surfaces
US4512107A · kind A · utility
15Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 1982 |
| Grant date | Apr 23, 1985 |
| Priority date | — |
| Expiry date | Nov 16, 2002 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B5/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automated polisher for cylindrical surfaces. A cylindrical workpiece is rotated about its longitudinal axis. A pad is urged against the inside of the workpiece as it is turned. The pad is quickly moved in a small circle or ellipse or in a short reciprocating motion. The pad is also moved longitudinally along the length of the workpiece so the center of quick pad movement traces a helix on the inner surface of the workpiece. The speed of movement of the center of quick pad movement is controlled as a function of the position of the pad relative to the workpiece so that a controlled polishing occurs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.