Process for producing printed circuit boards
US4512829A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1984 |
| Grant date | Apr 23, 1985 |
| Priority date | — |
| Expiry date | Apr 6, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention provides a process for producing a printed circuit board characterized by the steps of drilling holes in a copper clad laminate, treating the entire surface of the laminate including the hole-defining inner surfaces with a catalyst, removing the catalyst from the surface of the copper foil of the laminate by mechanically cleaning the surface of the copper foil, depositing electroless nickel only on the hole-defining inner surfaces, forming a pattern with an etching resist, etching away the copper foil except at the pattern area, removing the etching resist, masking with a solder resist the entire surface except at the hole-defining inner surfaces and the lands, and subjecting the hole-defining inner surfaces and the lands to electroless copper plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.