Stainless steel primer for sputtered films
US4512863A · kind A · utility
19Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1983 |
| Grant date | Apr 23, 1985 |
| Priority date | — |
| Expiry date | Sep 9, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12597
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method is disclosed for improving the adhesion of sputtered metal films such as silver and copper by means of first depositing a primer layer of a metal such as stainless steel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.