Platelet metal powder for coating a substrate
US4513020A · kind A · utility
4Cited by
1References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 1983 |
| Grant date | Apr 23, 1985 |
| Priority date | — |
| Expiry date | Apr 8, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C4/067
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention is for a flat platelet powder for deposition onto a substrate. The powder is formed by fracture of brittle sheet or ribbon. The resulting powder has a faceted outline formed by fracture. The powder of the present invention produces a dense deposit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.