Abrasive slurry supply system for use in metallographic sample preparation
US4513894A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1982 |
| Grant date | Apr 30, 1985 |
| Priority date | — |
| Expiry date | Oct 12, 2002 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An alumina slurry supply system for use in conjunction with a polisher or grinder apparatus or the like for preparing the surfaces of metallurgical specimens, the system comprising an alumina slurry reservoir, a recirculation pump disposed in the reservoir, an applicator arm for dispensing the abrasive slurry to a platen or lapping wheel of the polisher or grinder apparatus, a first conduit for receiving slurry pumped from the reservoir, a second conduit connected to the first conduit for recirculating the slurry to the reservoir, a third conduit leading from the first conduit to the applicator arm, a valve in the third conduit movable between an open position to supply abrasive slurry to the applicator arm and a closed position in which all abrasive slurry pumped from the reservoir is recirculated thereto, and a timer for controlling the operation of the valve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.