Method and apparatus for electroplating
US4514266A · kind A · utility
22Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1981 |
| Grant date | Apr 30, 1985 |
| Priority date | — |
| Expiry date | Sep 11, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/611
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for quality high speed electrical plating of one or both sides of a metallic workpiece 12 wherein a combined consumable-non-consumable anode system so provides a uniformity of metallic deposition at relatively high speeds irrespective of the consumable anode 15 contour. A metal ion containing plating solution flows into contact with a workpiece through apertures 86 in the non-consumable anode 16 while metal ion concentration is maintained. The consumable-non-consumable anode system is used in a vertical or horizontal submerged cell configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.