Through-hole plating
US4515829A · kind A · utility
46Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1983 |
| Grant date | May 7, 1985 |
| Priority date | — |
| Expiry date | Oct 14, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.