Crystallizing glass solders and stripping films with such glass solder imprinted thereon

US4515897A · kind A · utility

Assignee

• Schott Glaswerke · DE

Inventors

• Werner Sack · Mainz, DE
• Werner Kiefer · Ingelheim am Rhein, DE

Key dates

• Filing date: Jan 23, 1984
• Grant date: May 7, 1985
• Expiry date: Jan 23, 2004

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C03C8/24
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Partially crystallizing glass solders, and stripping films using them as agents to be transferred, which are sintered at temperatures below 900.degree. C. from glass powder with granulation of less than <150 .mu.m, thereafter exhibiting thermal expansion coefficients of -23.5 to 34.3.sup..multidot. 10.sup.-7.multidot. K.sup.-1, whose crystallization temperature lies below 710.degree. C. and whose crystal phase consists predominantly of h-quartz mixed crystal phase exhibiting the following composition (in weight %): 23-44 SiO.sub.2, 20-37 Al.sub.2 O.sub.3, 5.5-11 Li.sub.2 O; 3-20 B.sub.2 O.sub.3 ; 0-36 PbO; 0-1 Na.sub.2 O; 0-1.5 K.sub.2 O; 0-0.1 F; 0-4 TiO.sub.2 ; 0-3.5 MgO; 0-2 CoO, provided B.sub.2 O.sub.3 +PbO+Na.sub.2 O+K.sub.2 O+F+TiO.sub.2 is 8.5-50.0.