Process for forming conductive through-holes through a dielectric layer
US4517050A · kind A · utility
16Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1983 |
| Grant date | May 14, 1985 |
| Priority date | — |
| Expiry date | Dec 5, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive through-hole hole is formed through a dielectric sandwiched between conductors by forming a noncircular hole in a conductor, etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.