Forming of thick-layer, hybrid electronic printed circuits
US4517227A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1982 |
| Grant date | May 14, 1985 |
| Priority date | — |
| Expiry date | Nov 12, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Thick-layer hybrid electronic printed circuits are formed by printing predetermined circuit pattern onto an insulating substrate by deposition of predetermined ink pattern thereupon, advantageously by silk-screening or masking, and then baking said ink circuit pattern, and repeating the deposition/baking steps as required, the subject forming process featuring use of an insulating ink comprising a non-conductive metallic oxide extender, desirably cuprous oxide, which ink is thus either potentially conductive or potentially resistive, and the development of such conductivity or resistivity, after baking, by treating the ink pattern with a reducing agent, desirably a borohydride, as to readily and quantitatively convert said metal oxide into a conducting metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.