Selective plating
US4518636A · kind A · utility
6Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 3, 1983 |
| Grant date | May 21, 1985 |
| Priority date | — |
| Expiry date | Oct 3, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of selective plating a component, which method includes contacting upper and lower faces of the component with upper and lower masks, respectively, so that the lower mask exposes a part of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, the plating pressure and the hardness of the material of the upper mask being such that the upper mask is deformed during plating so as at least partially to mask the edge(s) of the exposed part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.