Patent · US Expired

Low density, modified polyimide foams and methods of making same

US4518717A · kind A · utility

47Cited by
3References
38Claims
0Family size

Inventors

Key dates

Filing dateNov 7, 1983
Grant dateMay 21, 1985
Priority date
Expiry dateNov 7, 2003

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08J2379/08
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Methods of making low density modified polyimide/polyimide-amide foams and the resulting compositions. An N-substituted aliphatic imide is prepared by reacting a suitable aromatic dianhydride with a suitable oxime. A polyimide forming material is prepared by dissolving the N-substituted aliphatic imide in an esterifying solvent, then adding a suitable aromatic diamine. This material is dried to a powder. A suitable hydrated compound which is stable up to at least about 100.degree. C. is mixed with the powder. A foam is then produced by heating the material to reaction temperature for a period sufficient to produce a stable foam. The material melts, then spontaneously expands into a foam which becomes self supporting and cures to a resilient flexible foam. The addition of the hydrated compound is found to result in an exceptionally low density foam. Depending upon heating conditions, a polyimide, polyimide-amide or mixture thereof may be produced, resulting in foams having selectively variable physical properties.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.