Low density, modified polyimide foams and methods of making same
US4518717A · kind A · utility
Inventors
Key dates
| Filing date | Nov 7, 1983 |
| Grant date | May 21, 1985 |
| Priority date | — |
| Expiry date | Nov 7, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Methods of making low density modified polyimide/polyimide-amide foams and the resulting compositions. An N-substituted aliphatic imide is prepared by reacting a suitable aromatic dianhydride with a suitable oxime. A polyimide forming material is prepared by dissolving the N-substituted aliphatic imide in an esterifying solvent, then adding a suitable aromatic diamine. This material is dried to a powder. A suitable hydrated compound which is stable up to at least about 100.degree. C. is mixed with the powder. A foam is then produced by heating the material to reaction temperature for a period sufficient to produce a stable foam. The material melts, then spontaneously expands into a foam which becomes self supporting and cures to a resilient flexible foam. The addition of the hydrated compound is found to result in an exceptionally low density foam. Depending upon heating conditions, a polyimide, polyimide-amide or mixture thereof may be produced, resulting in foams having selectively variable physical properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.