Multi-layer conductor plate and a method of making
US4520228A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 24, 1982 |
| Grant date | May 28, 1985 |
| Priority date | — |
| Expiry date | Aug 24, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4685
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer conductor plate consists of a copper-clad base plate (1) on which a first layer of conductor paths (2,3,4; 5,6,7) is formed by applying an etch-resistant, electrically conductive varnish at the respective locations. The copper layers not covered by the etch-resistant varnish are removed by etching in etching bath. Subsequently an insulating varnish layer (16) is applied at least in the area of intersections of conductor paths of the first layer and a second layer. A varnish adapted to be galvanized and preferably being carbonaceous is applied at predetermined locations and subsequently coated with a metal layer applied galvanically.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.