Hybrid integrated circuit and preparation thereof
US4521476A · kind A · utility
34Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1983 |
| Grant date | Jun 4, 1985 |
| Priority date | — |
| Expiry date | Jun 22, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.