Process and apparatus for surfacing with high deposition and low dilution
US4521664A · kind A · utility
19Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 1982 |
| Grant date | Jun 4, 1985 |
| Priority date | — |
| Expiry date | Oct 26, 2002 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K9/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A metal deposition process and apparatus is used to surface materials and includes a power supply connected to electrode wires and to the workpiece to establish a wire arc between the electrodes and a substrate arc between the positive electrode and the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.