Heat sink mounting
US4521827A · kind A · utility
16Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 1983 |
| Grant date | Jun 4, 1985 |
| Priority date | — |
| Expiry date | Jan 12, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.