Method of applying an electrical conductor pattern on an apertured substrate

US4522671A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Werner Grunwald · Gerlingen, DE
• Heinz Pfizenmaier · Leonberg, DE
• Claudio De La Prieta · Stuttgart, DE
• Kurt Schmid · Ditzingen, DE
• Ewald Schmidt · Ludwigsburg, DE

Key dates

• Filing date: Nov 12, 1982
• Grant date: Jun 11, 1985
• Expiry date: Nov 12, 2002

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4902
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

To make inductance elements, thick film electrically conductive paste, which may include precious metal such as silver, are applied by a deformable stamp on a ferrite core which, for example, can be someone hump shaped, for adhesion to a carrier (30) and formed with openings thereto, the stamp being shaped to fit within the opening and deforming to penetrate the opening to apply the thick film conductive paste in form of conductive tracks thereon. Conductive tracks can be applied, previously, to a substrate carrier (30), which are then joined by the paste strips to form interconnected windings (FIGS. 1a, 1b); or the ferrite may be in form of a toroidal core (34), on which the conductive tracks are applied around all surfaces, to form connected windings thereon, the deformable stamp having a projecting tip which can fit within the opening of the toroidal core.