Polymeric substrates for electroless metal deposition
US4522850A · kind A · utility
8Cited by
4References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 5, 1982 |
| Grant date | Jun 11, 1985 |
| Priority date | — |
| Expiry date | Apr 5, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0759
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
New polymeric substrates for the electroless deposition of metal thereon. The substrates of the invention result from the polymerization of liquid mixtures comprising a liquid precursor of a polymer that is relatively susceptible to oxidative attack and a liquid precursor of a polymer that resists oxidation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.