Thick polyimide-metal laminates with high peel strength
US4522880A · kind A · utility
31Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1983 |
| Grant date | Jun 11, 1985 |
| Priority date | — |
| Expiry date | Sep 21, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laminate comprising an insoluble, intractable relatively thick layer of a polyimide bonded tightly onto a metallic substrate without the necessity for an intermediate adhesive bonding layer and a process for preparing such by directly extruding a polyamic acid polyimide-precursor onto said substrate and converting said polyamic acid to the polyimide in a single pass in at least two heating stages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.