Method of making a low-profile crystal package with an improved crystal-mounting arrangement
US4524497A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 1984 |
| Grant date | Jun 25, 1985 |
| Priority date | — |
| Expiry date | Feb 15, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.