Process for the manufacture of multi-layer particle board using a phenol formaldehyde resin having a lower solids content
US4525227A · kind A · utility
2Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1983 |
| Grant date | Jun 25, 1985 |
| Priority date | — |
| Expiry date | Dec 5, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3196
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for the manufacture of triple- and multi-layer particle board employing phenol formaldehyde resin compositions for gluing particles in the outer layers of the board characterized by the use of a phenol formaldehyde resin composition having a viscosity of about 30-90 seconds (4-mm DIN cup), a solids content of between about 30 and 39 percent by weight and an alkali content of less than 8 percent by weight is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.