High-density electronic processing package-structure and fabrication
US4525921A · kind A · utility
219Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1983 |
| Grant date | Jul 2, 1985 |
| Priority date | — |
| Expiry date | Jul 25, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation material, and thereafter lapped to uncover the ends of electrical leads on the chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.