Multi-layer printed circuit board and process for production thereof
US4526835A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1983 |
| Grant date | Jul 2, 1985 |
| Priority date | — |
| Expiry date | Oct 12, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A multi-layer printed circuit board produced by laminating a plurality of unit circuit sheets via prepreg resin sheets, the cured resin in said unit circuit sheet having a glass transition temperature Tg.sub.1, said prepreg resin sheets having been prepared by impregnating a reinforcing substrate with a resin composition which can be cured at a temperature equal to or lower than both the glass transition temperature of Tg.sub.1 and that of Tg.sub.2 of the resin in the prepreg resin sheet after cured, and binding the laminated sheets with heating under pressure at a temperature equal to or lower than both the temperatures of Tg.sub.1 and Tg.sub.2, has excellent dimensional stability, heat resistance and through-hole reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.