Adhesive spot curing press and method for metallic parts
US4528057A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1983 |
| Grant date | Jul 9, 1985 |
| Priority date | — |
| Expiry date | Sep 8, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J5/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive bonding press having a "C" frame which mounts upper and lower platens, one of which supports an induction coil mounted in a non-metallic tube. Adhesive is applied to coat the top surface of a lower metallic plate supported on the lower platen, after which a second metallic plate is laid thereon. Thereafter, the plates are clamped together by an air cylinder through upper and lower platens and tooling holders of the press, one of which includes an induction coil. High frequency current is then applied to the induction coil which rapidly heats the adhesive for 2 to 3 seconds. An air blast is then induced in the upper and lower tooling to rapidly cool the parts to room temperature. Spot curing takes place in the area axially of the induction coil which very firmly bonds the two plates together so that further operations in a production or automation line will take place immediately. The spot curing may be done in a number of spots on larger pieces or, for small pieces, may cover the entire area of the adhesive when metallic pieces are to be adhered together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.