Process for manufacturing hollow multilayer printed wiring board
US4528072A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1982 |
| Grant date | Jul 9, 1985 |
| Priority date | — |
| Expiry date | Jun 29, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates, superposed upon each other with a predetermined space therebetween. Each of the substrate has a signal conductor pattern formed on at least one surface thereof and a land conductor pattern formed on at least one surface thereof. Each substrate has plated through holes in the land conductor pattern, each of which holes is in line with another plated through hole of at least one of the neighboring substrates to form a continuous through hole or an interstitial through hole. A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each of the plated through holes. This layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates. The superposed substrates, except for at least one surface substrate, are made of a thermally resistant organic synthetic resin sheet or an insulation-treated metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.