Method and apparatus for mounting multilead components on a circuit board
US4528747A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1982 |
| Grant date | Jul 16, 1985 |
| Priority date | — |
| Expiry date | Dec 2, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for mounting one or a plurality of multilead components (25-28) on a circuit board (20) is herein disclosed. The method comprises the steps of loading a releasable template (32) with the component/components to be mounted, positioning the releasable template proximate to the board, releasing the component/components from the template onto the board such that each lead of each component is proximate to a corresponding aperture in the board, and imparting a vibratory motion (via 29 and 23) to the board thereby inserting the component/components into the board. Also disclosed are various embodiments of an apparatus for achieving this mounting method using a programmable robotic arm (FIG. 2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.