Thermosetting resin patching compound
US4529757A · kind A · utility
6Cited by
15References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1983 |
| Grant date | Jul 16, 1985 |
| Priority date | — |
| Expiry date | Sep 9, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S524/919
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method for repairing plastics, metal and the like. The method uses a compound comprising a thermosetting unsaturated polyester resin, a thermoplastic resin mixed with said polyester, particulate inorganic filler, as well as additional metallic particulate material, fibrous materials and a catalyst. The compound when cured at a relatively elevated temperature of about 325.degree.-350.degree. F. provides a low shrink material which can be painted and baked on normal processing lines up to 350.degree. F. without separating from the underlying substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.