Low-cost power device package with quick connect terminals and electrically isolated mounting means
US4530003A · kind A · utility
14Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1983 |
| Grant date | Jul 16, 1985 |
| Priority date | — |
| Expiry date | Nov 3, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package structure having a conventional base outline, a heat spreader, and top-mounted, quick-connect terminals for external connection is described. A pre-packaged semiconductor device is attached to a lead frame containing terminals in a predetermined configuration, and then overmolded with a plastic encapsulant so that the heat spreader of the prepackaged device protrudes a predetermined distance from the mounting surface of the package to make possible good thermal contact with a heat sink. Insulated means to facilitate mounting are built-in.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.