Polyamide-imide resin composition
US4530975A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1982 |
| Grant date | Jul 23, 1985 |
| Priority date | — |
| Expiry date | Sep 30, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide-imide resin composition comprising (A) a polyamide-imide resin modified with a polyisocyanate containing one or more isocyanurate rings and a lactam and (B) at least one member selected from the group consisting of (i) an alkoxy modified amino resin, (ii) a polyisocyanate containing one or more isocyanurate rings, (iii) a phenol-formaldehyde resin, (iv) an epoxy resin, (v) a polyester resin having one or more hydroxyl groups obtained by using terephthalic acid and/or isophthalic acid as an acid component, and (vi) a metal salt of Sn, Mn, Co or Zn, can give fast curing properties to the resin composition without lowering heat resistance, flexibility, abrasion resistance and also giving good surface appearance to the coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.