Forging die package
US4531396A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1983 |
| Grant date | Jul 30, 1985 |
| Priority date | — |
| Expiry date | May 26, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49513
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A die package for forming a central disc structure having a plurality of integrally formed appendages extending therefrom includes a cylindrical array of appendage forming, abutting die segments which are prevented from tilting or moving in a circumferential direction by means of pins extending into slots formed along the parting lines between abutting die segments in the upper surfaces of the segments. In one embodiment, the pins extend upwardly from between opposed, parallel, radially and axially extending walls of each slot and fit tightly between said walls. The upper ends of the pins are secured to a rigid annular ring overlying the slots. The slots extend radially inwardly of the pins to allow the die segments to be moved radially outwardly after forging to release the forging from the die package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.