Method and article for facilitating the manufacture of a bondable metallic surface
US4531566A · kind A · utility
12Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 6, 1984 |
| Grant date | Jul 30, 1985 |
| Priority date | — |
| Expiry date | Apr 6, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A pad eliminatable by heat prior to casting has a patterned surface and a non-porous backing. The pad is sized and shaped into at least part of the appliance and the patterned surface is conformed to the desired bonding surface contour. The patterned surface yields irregularities in the cast bonding surface which increases bondability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.