Patent · US Expired

Method and apparatus for the manufacture of molded packings

US4532093A · kind A · utility

12Cited by
8References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 14, 1983
Grant dateJul 30, 1985
Priority date
Expiry dateApr 14, 2003

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2031/7138
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method and system are described for manufacturing molded packings used in the shipment of articles such as computers, typewriters and the like. The system employs a plurality of mold plugs positioned on a rotating platform whereby the mold plugs are alternately moved between work stations. At one work station a separator sheet is manually placed over a mold plug. At another work station a foaming material dispensing gun is automatically operated in a predetermined pattern over a mold which encloses the mold plug. The pattern is manually adjustable to fit any particular mold plug. Control over the system is obtained with a microprocessor programmed to operate with sensors and actuators associated with the system.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.