Method of bonding magnetic particles to a resin particle
US4532153A · kind A · utility
4Cited by
9References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 29, 1983 |
| Grant date | Jul 30, 1985 |
| Priority date | — |
| Expiry date | Jul 29, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F1/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Plastic particles having diameters of from about 1 to about 150 microns, a polymeric bonding layer on the surface thereof, are coated with magnetic particles to provide a generally uniform coating having a thickness of from about 0.05 to about 0.8 of a micron.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.