Coil assembly having stacked spiral pattern layers and method of making
US4532620A · kind A · utility
8Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1982 |
| Grant date | Jul 30, 1985 |
| Priority date | — |
| Expiry date | Jul 21, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F17/0006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil assembly comprises a plurality of conductive spiral pattern layers which are piled up via (an) insulating layer(s) on a wafer. The electrical connection between the spiral patterns is established by means of a conductive member, which is a portion of the upper spiral pattern layer, filled in a through-hole which is made in the insulating layer so that the spiral patterns are connected in series to develop a high voltage when the coil assembly is moved in a magnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.