Method for providing an electroless copper plating bath in the take mode
US4534797A · kind A · utility
5Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 1984 |
| Grant date | Aug 13, 1985 |
| Priority date | — |
| Expiry date | Jan 3, 2004 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent; solving the equation: EQU R=(CABD)/E wherin C is the concentration of cupric salt, A is the concentration of reducing agent, B is the concentration of oxygen, D is the concentration of cyanide salt, E is the concentration of complexing agent, and R is a unitless number. The bath is provided with quantities of the above ingredients so that R in the equation is between about 5 and about 15.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.