Circuit module with enhanced heat transfer and distribution
US4535385A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1983 |
| Grant date | Aug 13, 1985 |
| Priority date | — |
| Expiry date | Apr 22, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.