Microencapsulated epoxy adhesive system
US4536524A · kind A · utility
40Cited by
24References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1982 |
| Grant date | Aug 20, 1985 |
| Priority date | — |
| Expiry date | Jun 15, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2985
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A microencapsulated epoxy adhesive system is disclosed comprising in admixture epoxy resin capsules and encapsulated Ancamine TL (Pacific Anchor Chemical Co.) as the curing agent. When applied, for example to a zinc plated bolt and the bolt is tightened, the capsules break and the resin cures and provides good breakaway torques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.