Mo-Ti members with non-metallic sintering aids
US4537323A · kind A · utility
7Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1984 |
| Grant date | Aug 27, 1985 |
| Priority date | — |
| Expiry date | Jan 9, 2004 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J61/363
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Boron, oxygen, or a mixture thereof, is used as a sintering aid in sintering Mo-Ti alloys. Compounds formed between these sintering aids and the Mo or Ti have thermal expansion coefficients consistent with that of alloys of Mo and Ti. An hermetic member may be made using these constituents. The hermetic member may be used to seal an assembly such as a high pressure sodium lamp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.