Power chip package
US4538170A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jan 3, 1983 |
| Grant date | Aug 27, 1985 |
| Priority date | — |
| Expiry date | Jan 3, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat-generating power semiconductor chip is mounted in a package to permit testing or use of the chip before or after mounting of the package to a heat spreader plate. A plurality of sheet metal leads are attached to a dielectric substrate, such as beryllia. The leads are patterned in mirror image fashion to a plurality of terminals on one side of the power chip. In one form, a further sheet metal lead is attached to a further dielectric substrate and is adapted to abut a terminal on the other side of the power chip. In another form, heat transfer structure is provided for transferring heat between the pair of dielectric substrates, thereby enabling heat to be removed from both sides of the power chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.