High power semiconductor heat sink assembly
US4538171A · kind A · utility
13Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1981 |
| Grant date | Aug 27, 1985 |
| Priority date | — |
| Expiry date | Oct 9, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high power semiconductor heat sink assembly comprising a semiconductor slice or chip and a heat sink structure. The heat sink structure comprises two spaced apart thermally and electrically conductive plates of for example aluminum between which the slice or chip is clamped. A device such as an O-ring is sandwiched between the plates so as to extend around the slice or chip and define a sealed compartment within which the slice or chip is located. An electrically non-conductive thermally conductive material such as a resin comprising alumina fills the space between the plates outside the compartment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.