Method for grinding or cutting a workpiece
US4538384A · kind A · utility
1Cited by
5References
8Claims
0Family size
Inventors
Key dates
| Filing date | Jul 15, 1982 |
| Grant date | Sep 3, 1985 |
| Priority date | — |
| Expiry date | Jul 15, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
During the grinding of a workpiece a body separate from the abrasive disk is fed to the zone of cutting and arranged therein. Said body is solid at room temperatures of between 1.degree. C. and 200.degree. C. and contains materials assisting the grinding process, such as cryolite, pyrite etc., or is formed by such materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.