Method for depositing material with nanometer dimensions
US4539089A · kind A · utility
14Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1984 |
| Grant date | Sep 3, 1985 |
| Priority date | — |
| Expiry date | Jun 29, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/143
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This method involves the deposition of free metal atoms (4) from the apex (5) of a pointed tip (1) supported at a distance of 10 to 20 nm from a substrate (2). The atoms (4) are being field-desorbed under the influence of a strong electric field existing between the tip (1) and the substrate (2). With the tip (1) being moved across the substrate (2), a narrow trace (6) of metal atoms will be deposited on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.