Resist material and process for forming fine resist pattern
US4539250A · kind A · utility
13Cited by
5References
4Claims
0Family size
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Key dates
| Filing date | Dec 17, 1982 |
| Grant date | Sep 3, 1985 |
| Priority date | — |
| Expiry date | Dec 17, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24826
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist material of positive type having a high sensitivity, a high resolving power and an excellent adhesion property to substrates, which comprises a copolymer of a fluoroalkyl acrylate having the general formula: ##STR1## wherein R.sub.1 is methyl group, ethyl group, a halogen-substituted methyl or ethyl group, a halogen atom or hydrogen atom, R.sub.2 is a bivalent hydrocarbon group having 1 to 6 carbon atoms, and R.sub.f is a fluoroalkyl group having 1 to 15 carbon atoms, with an acrylic comonomer selected from the group consisting of a glycidyl acrylate, an acrylic acid, an acrylamide and an .alpha.-cyanoacrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.