Hollow microspheres with organosilicon-silicate walls
US4540629A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1984 |
| Grant date | Sep 10, 1985 |
| Priority date | — |
| Expiry date | Feb 27, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31612
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Hollow microspheres of reduced surface energy and reactivity and of improved packing and sphericity are prepared by simultaneously forming said microspheres and reacting them with an organosilicon compound. The microspheres are prepared by spray drying a solution of alkali metal silicate and a "polysalt." The organosilicon is present as the microspheres are formed, penetrates and reacts to form a shell consisting of a silicate, polysalt and the organosilicon compound. The resulting product is more discrete, more free-flowing, has better packaging characteristics, improved packing factor and improved filler properties when compared to prior-art microspheres.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.