Aerodynamically enhanced heat sink
US4541004A · kind A · utility
35Cited by
3References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1982 |
| Grant date | Sep 10, 1985 |
| Priority date | — |
| Expiry date | Nov 24, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aerodynamically enhanced heat sink is disclosed, which heat sink includes a plurality of metallic pins each having one end thereof affixed to the integrated circuit package and the second end thereof being disposed for heat dissipation. The plurality of pins are made of varying lengths such that a partial hemisphere is formed with the second ends thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.