Patent · US Expired

Process for forming foundry components

US4541869A · kind A · utility

5Cited by
3References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 15, 1983
Grant dateSep 17, 1985
Priority date
Expiry dateAug 15, 2003

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC04B28/26
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Aqueous alkali metal silicate bonding compositions having a molar ratio of SiO.sub.2 :Me.sub.2 O of 2.4:1 to 3.4:1, wherein Me is sodium and/or potassium, a solids content of about 35 to 50 percent by weight, and containing triethanolamine. The bonding compositions can be mixed with fillers such as quartz sand and used for the manufacture of molded forms for the casting of metals.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.