Process for forming foundry components
US4541869A · kind A · utility
5Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1983 |
| Grant date | Sep 17, 1985 |
| Priority date | — |
| Expiry date | Aug 15, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B28/26
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Aqueous alkali metal silicate bonding compositions having a molar ratio of SiO.sub.2 :Me.sub.2 O of 2.4:1 to 3.4:1, wherein Me is sodium and/or potassium, a solids content of about 35 to 50 percent by weight, and containing triethanolamine. The bonding compositions can be mixed with fillers such as quartz sand and used for the manufacture of molded forms for the casting of metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.