Metallizable, essentially isotropic polymeric substrates well adopted for printed circuits
US4541894A · kind A · utility
25Cited by
3References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 29, 1984 |
| Grant date | Sep 17, 1985 |
| Priority date | — |
| Expiry date | May 29, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/656
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Essentially isotropic metallizable polymeric substrates having very low coefficients of thermal expansion are well adopted for printed circuits, are facilely prepared by papermaking technique and hot pressing, and are comprised of a fibrous polymer matrix, advantageously an aramide non-woven batt, bonded together with a cured imido prepolymer, and include particulate filler material, advantageously electrically insulating metal oxide particles, distributed therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.